VIAMP
The VIAMP preamplifier modules are specially designed printed circuit boards for operation with KETEK’s VITUS Silicon Drift Detectors (SDD). The assembly comprises an ultra-low noise, ramped reset type electronic preamplifier of positive polarity with onboard settings and filtering for all necessary SDD bias voltages.
Depending on the size and application of the SDD module, three standard Aluminum housing options are available for the electronic boards, which provide appropriate protection and serve as a sufficient heat sink.
VICO-DV/-AV 3.0
3rd generation of the VICO-DV/-AV electronics board with (-DV) or without (-AV) a digital pulse processor DPP3
Unique Features
- Complete electronics for VIAMP modules with all supplies for SDD, cooling and temperature controller
- KETEKs in-house developed DPP3 allows
→ Peaking times down to 25 ns
→ High count rate capability of up to 2 Mcps - Ultra small dimensions: 60 x 32 x 11 mm³
- Ethernet, USB and SPI interface
- Comprehensive programming library (VICOLib), acquisition software (VICOScope) and update tool (VICOUpdate) available for Windows and Linux
- Firmware updates accessible
VICO-DV 3.0 with DPP3
VICO-DV 3.0 with DPP3, bottom view
VICO-DV 3.0 with VICO Adapter board for Ethernet, USB and SPI connection
Available Options
Technical Data VICO-DV 3.0
| Parameter | Typical | Note |
| PCB Dimensions | 60 x 32 x 11 mm³ | |
| Weight | 23 g ± 1 g | |
| Operating Temperature Range | 0 °C to +50 °C | |
| Storage Temperature Range | -30 °C to +80 °C | |
| Operating Humidity Range | 5 % to 80 % | non-condensing |
| DC Input Voltage | +5 V to +12 V ± 10 % | for an SDD with a TEC current greater 900 mA, values above 10 V are mandatory |
| Voltage Ripple (5 VDC) | 50 mVpp | |
| Current (5 VDC)* | 550 mA | max. 1160 mA |
| Dissipation Loss | 2250 mW | max. 2750 mW |
| DPP3 | ||
| Digital Interfaces | 100 Mbit/s Ethernet USB 2.0 SPI |
|
| Number of Bins | max. 8192 | |
| Bin Depth | 8 to 24 bit | |
| ADC | 16 bit | |
| Clock Frequenzy | 80 MHz | |
| Peaking Time Range | 25 ns – 12.6 µs | |
| Max. Read-out Speed | 0.69 ms (512 Bins, 2 Bytes/Bin) | Recommended 0.75 ms |
*at +20 °C housing temp., -35 °C SDD chip temp., steady state with all interfaces activated
Throughput
Optimized for high throughput
The graph shows the throughput curves and the concerning energy resolution for a VITUS H7 SDD module with VICO-DV 3.0 electronics at different peaking times between 25 and 100 ns. The parameter settings were optimized for high throughput with a gap time of 100 ns.
Optimized for high energy resolution
The graph shows the throughput curves and the concerning energy resolution for a VITUS H7 SDD module with VICO-DV 3.0 electronics at different peaking times between 25 ns and 2 μs. The parameter settings here were optimized for high energy resolution (gap time = 300 ns).
All spectra have been acquired in KETEKs standard end qualification test stand with an Fe-55 source and at an SDD chip temperature of -35 °C.
Operation Block Diagram
Geometry
Pin Assignment
8-Pin FFC
VICO-DV 3.0 communication with VIAMP module
Connector: LSHM-130-02.5-L-DV-A-S-K-TR
Mating Connector: e.g. LSHM-130-0X.X-X-DV-A-X-K-TR
Grounding and Thermal Scheme
- The VIAMP needs to be mounted using a gap pad which is electrically isolating but thermally conductive, as the VIAMP housing functions as a heat sink.
- The DV 3.0 board can be easily attached to a heatsink by the plane shield surfaces either on the top or bottom side.
Related Products
Available Signal Processing Electronics & Accessories
